Effects of Voiding on the Degradation of Microvias Boards Under Thermomechanical Stresses (Record no. 53358)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 01879nam a2200277Ia 4500 |
| 003 - CONTROL NUMBER IDENTIFIER | |
| control field | MX-MdCICY |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20250625162427.0 |
| 040 ## - CATALOGING SOURCE | |
| Transcribing agency | CICY |
| 090 ## - LOCALLY ASSIGNED LC-TYPE CALL NUMBER (OCLC); LOCAL CALL NUMBER (RLIN) | |
| Classification number (OCLC) (R) ; Classification number, CALL (RLIN) (NR) | B-19220 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 250602s9999 xx |||||s2 |||| ||und|d |
| 245 10 - TITLE STATEMENT | |
| Title | Effects of Voiding on the Degradation of Microvias Boards Under Thermomechanical Stresses |
| 490 0# - SERIES STATEMENT | |
| Volume/sequential designation | IEEE Transactions on Components, Packaging and Manufacturing Technology, 4(8), p.1374-1379, 2014 |
| 520 3# - SUMMARY, ETC. | |
| Summary, etc. | Printed circuit boards (PCBs)are made of several dielectric layers stacked on top of each other. These layers could be standard PCB core board or high density interconnect (HDI)layers. Microvias allow signal and power transmission between the HDI layers of the PCBs. The presence of voiding in filled microvias has raised concerns in industry about how they affect the degradation of microvias during the life cycle of the product. Voids can vary widely in shape and size and have been observed in both stacked and single-level microvias. This paper examines whether the presence of voids alone is responsible for the degradation of microvias, or if parameters such as void size and void shape have an influence as well. Both voided and nonvoided microvias were tested together using liquid-to-liquid thermal shock as the accelerated testing method to understand their different behaviors under thermomechanical stresses. |
| 650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | ACCELERATED TESTING |
| 650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | HIGH DENSITY INTERCONNECT (HDI) |
| 650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | MICROVIA |
| 650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | PRINTED CIRCUIT BOARDS (PCBS) |
| 650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | RELIABILITY |
| 650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | THERMALSHOCK |
| 650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | VOIDING |
| 700 12 - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Bakhshi, R. |
| 700 12 - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Azarian, M. H. |
| 700 12 - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Pecht, M. G. |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | <a href="https://drive.google.com/file/d/1Jy_kb2bqieT1ou7N7tfgK4lWOX4HoOqr/view?usp=drivesdk">https://drive.google.com/file/d/1Jy_kb2bqieT1ou7N7tfgK4lWOX4HoOqr/view?usp=drivesdk</a> |
| Public note | Para ver el documento ingresa a Google con tu cuenta: @cicy.edu.mx |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Source of classification or shelving scheme | Clasificación local |
| Koha item type | Documentos solicitados |
| Lost status | Source of classification or shelving scheme | Damaged status | Not for loan | Collection | Home library | Current library | Shelving location | Date acquired | Total checkouts | Full call number | Date last seen | Price effective from | Koha item type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Clasificación local | Ref1 | CICY | CICY | Documento préstamo interbibliotecario | 25.06.2025 | B-19220 | 25.06.2025 | 25.06.2025 | Documentos solicitados |