MEMS/NEMS (Record no. 56481)

MARC details
000 -LEADER
fixed length control field 08664nam a22004695i 4500
001 - CONTROL NUMBER
control field 978-0-387-25786-0
003 - CONTROL NUMBER IDENTIFIER
control field DE-He213
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20250710083934.0
007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION
fixed length control field cr nn 008mamaa
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 100301s2006 xxu| s |||| 0|eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9780387257860
-- 99780387257860
024 7# - OTHER STANDARD IDENTIFIER
Standard number or code 10.1007/b136111
Source of number or code doi
100 1# - MAIN ENTRY--PERSONAL NAME
Personal name Leondes, Cornelius T.
Relator term editor.
245 10 - TITLE STATEMENT
Title MEMS/NEMS
Medium [recurso electrónico] :
Remainder of title Handbook Techniques and Applications /
Statement of responsibility, etc. edited by Cornelius T. Leondes.
264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE
Place of production, publication, distribution, manufacture Boston, MA :
Name of producer, publisher, distributor, manufacturer Springer US,
Date of production, publication, distribution, manufacture, or copyright notice 2006.
300 ## - PHYSICAL DESCRIPTION
Extent XCII, 2096 p. 550 illus.
Other physical details online resource.
336 ## - CONTENT TYPE
Content type term text
Content type code txt
Source rdacontent
337 ## - MEDIA TYPE
Media type term computer
Media type code c
Source rdamedia
338 ## - CARRIER TYPE
Carrier type term recurso en línea
Carrier type code cr
Source rdacarrier
347 ## - DIGITAL FILE CHARACTERISTICS
File type text file
Encoding format PDF
Source rda
505 0# - FORMATTED CONTENTS NOTE
Formatted contents note Manufacturing Advisory Service System for Concurrent and Collaborative Design of MEMS Devices -- Web-Enabled Knowledge-Intensive Support Framework for Collaborative Design of MEMS -- Web-Enabled Database System Development for Design and Manufacturing of Micro-Electro-Mechanical Systems (MEMS) -- Techniques in Proper Orthogonal Decomposition and Component Mode Synthesis for the Dynamic Simulation of Complex MEMS Devices and Their Applications -- Techniques in Global Optimal Design for MEMS & Their Applications -- Theory and Design of Micromechanical Vibratory Gyroscopes -- A Hierarchical Design Platform for Microelectrofluidic Systems (MEFS) -- Techniques in Electrostatics Analysis of MEMS and Their Applications -- Techniques for Efficient Analytical and Simulation Methods in the Prototyping of MEMS Systems -- Techniques in the Fabrication of High-Speed Micro-Rotors for MEMS Applications -- Fabrication Techniques in Micromachined Capacitive Ultrasonic Transducers and their Applications -- GaAs Thermally Based MEMS Devices-Fabrication Techniques, Characterization and Modeling -- Novel MEMS Fluidic Integrated Circuit Technology with 'MOSFET-Like Microvalve Elements' -- Hydrogel-based ?TAS -- Crosslinked PMMA as a Low-Dimensional Dielectric Sacrificial Layer for MEMS/NEMS and Quantum Nanostructures Fabrication -- MEMS/NEMS Techniques and Applications -- Techniques in the Development of Micromachine Tool Prototypes & Their Applications in Microfactories MET Technology -- Tool-based Micro Machining and Applications in MEMS -- Micro-machined Passive Valves: Fabrication Techniques, Characterisation and their Application -- Rapid Prototyping and Rapid Tooling Techniques for the Manufacturing of Silicon, Polymer, Metal and Ceramic Microdevices -- Injection Molding Techniques for the Fabrication of MEMS Elements -- Excimer Laser Micromachined Three-dimensional Microstructures-Techniques and Applications -- Techniques in Scanning Acoustic Microscopy for Enhanced Failure and Material Analysis of Microsystems -- Production Scheduling in MEMS Manufacturing -- MEMS-based Accelerometers and their Application to Vibration Suppression in Hard Disk Drives -- Micromachined Thermal Accelerometer without Proof Mass -- Techniques in MEMS Devices for Micro Humidity Sensors and Their Applications -- Modeling the Electromechanical Response of Electrostatic Actuators -- Micropumps for MEMS/NEMS and Microfluidic Systems -- FEM (Finite Element Modeling) Techniques for Electrostatic Microactuators -- Techniques in the Design of Thermomechanical Microactuators -- Techniques in MEMS Microthermal Actuators and Their Applications -- Techniques in Residual Stress Measurement for MEMS and Their Applications -- Techniques in Sonophoresis Biomedical Devices and Their Applications -- MEMS Application of Actuators and Sensors for Glaucoma Treatment -- Single-Crystal Silicon Based Electrothermal MEMS Mirrors for Biomedical Imaging Applications -- Techniques in the Development of Endovascular Microtools & Their Applications -- Techniques in the Design and Fabrication of Optical MEMS Switches and their Application in Optical Communication Systems -- Micromachining Techniques and MEMS Structures in Optical Interferometric Sensors -- Magnetic Microactuators-Techniques and Applications -- Techniques in the Design of Micro-Machined Electrostatic Torsion Micro-Mirrors and Their Applications -- Vertical Combdrive Actuator: Design and Fabrication for Micromirror Applications -- Three-Dimensional Techniques for FEM Simulations in Laser Modules and Their Applications.
520 ## - SUMMARY, ETC.
Summary, etc. Micro-Electro Mechanical Systems (MEMS) is the integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate. While the electronics are fabricated using integrated circuit (IC) process sequences (e.g., CMOS, Bipolar, or BICMOS processes), the micromechanical components are fabricated using compatible micromachining processes that selectively etch away parts of the silicon wafer or add new structural layers to form the mechanical and electromechanical devices. MEMS promises to revolutionize nearly every product category by bringing together silicon-based microelectronics with micromachining technology, thereby, making possible the realization of complete systems-on-a-chip. Microelectromechanic systems will revolutionize the design of electronics products and enable the creation of entirely new product categories. Through miniaturization, batch fabrication, and integration with electronics, this technology will enable the development of smart products by providing the required interface between the available computational power and physical world through the perception and control capabilities of micro devices or systems (e.g., microsensors and microactuators). Micromechanical devices and systems are inherently smaller, lighter and faster than their macroscopic counterparts, and in many cases are also more precise. MEMS devices are emerging as a product differentiators in numerous markets. MEMS technology is expected to have enormous opportunities in the commercial markets due to the low-cost, high functionality, and small size and weight of the devices. MEMS technology allows much more functionality to be placed within a given space than conventional technologies. A special class of MEMS is optical MEMS technology, also referred to as MOEMS (Micro Optical Mechanical Systems). MOEMS have become increasingly important in the development of many networks, telecommunications and optical systems. Potential MOEMS applications include optical data storage, optical sensors, bead mounted displays and projection systems. State-of-the-art devices include torsional mirrors, digital micromirror devices, laser scanners, optical shutters, microooptical switches, and micromachined corner cube reflectors. Nanoelectromechanical systems (NEMS) are MEMS scaled to submicrometer dimensions, to exploit the mechanical degree of freedom on the nanometer scale. In this size regime, it is possible to attain extremely high fundamental frequencies while simultaneously preserving high mechanical responsivity. This combination of attributes translates directly into high force sensitivity, operability at ultra-low power, and the ability to induce non-linearity with very modest control forces, leading to potential payoffs in a diverse range of fields from medicine to biotechnology. The MEMS/NEMS HANDBOOK consists of five volumes and will provide a significant and uniquely comprehensive reference source for research workers, practitioners, computer scientists, students, technologists and others on the international scene for years to come: (1) MEMS/NEMS Design Methods in MEMS/NEMS (2) Fabrication Techniques in MEMS/NEMS (3) Manufacturing Methods (4) Sensors & Actuators (5) Medical Applications and MOEMS This landmark work features contributions from more than 100 of the world's foremost authorities on the key technologies and the greatly significant application areas of MEMS/NEMS. The contributors come from industry, government and academia.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element CHEMISTRY.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element MECHANICAL ENGINEERING.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element ENGINEERING DESIGN.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element ELECTRONICS.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element OPTICAL MATERIALS.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element NANOTECHNOLOGY.
650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element CHEMISTRY.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element NANOTECHNOLOGY.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element ELECTRONICS AND MICROELECTRONICS, INSTRUMENTATION.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element MECHANICAL ENGINEERING.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element ENGINEERING DESIGN.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element OPTICAL AND ELECTRONIC MATERIALS.
710 2# - ADDED ENTRY--CORPORATE NAME
Corporate name or jurisdiction name as entry element SpringerLink (Online service)
773 0# - HOST ITEM ENTRY
Title Springer eBooks
776 08 - ADDITIONAL PHYSICAL FORM ENTRY
Relationship information Printed edition:
International Standard Book Number 9780387245201
856 40 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier <a href="http://dx.doi.org/10.1007/b136111">http://dx.doi.org/10.1007/b136111</a>
Public note Ver el texto completo en las instalaciones del CICY
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-- ZDB-2-CMS
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Source of classification or shelving scheme Dewey Decimal Classification
Koha item type Libros electrónicos
Holdings
Lost status Source of classification or shelving scheme Damaged status Not for loan Collection Home library Current library Shelving location Date acquired Total checkouts Date last seen Price effective from Koha item type
  Dewey Decimal Classification     Libro electrónico CICY CICY Libro electrónico 10.07.2025   10.07.2025 10.07.2025 Libros electrónicos