MARC details
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03695nam a22005055i 4500 |
| 001 - CONTROL NUMBER |
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978-0-387-28843-7 |
| 003 - CONTROL NUMBER IDENTIFIER |
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DE-He213 |
| 005 - DATE AND TIME OF LATEST TRANSACTION |
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| control field |
20250710083943.0 |
| 007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION |
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cr nn 008mamaa |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
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100301s2006 xxu| s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
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| International Standard Book Number |
9780387288437 |
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99780387288437 |
| 024 7# - OTHER STANDARD IDENTIFIER |
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| Standard number or code |
10.1007/0-387-28843-0 |
| Source of number or code |
doi |
| 100 1# - MAIN ENTRY--PERSONAL NAME |
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| Personal name |
Laconte, J. |
| Relator term |
author. |
| 245 10 - TITLE STATEMENT |
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| Title |
Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration |
| Medium |
[recurso electrónico] / |
| Statement of responsibility, etc. |
by J. Laconte, D. Flandre, J. -P. Raskin. |
| 264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE |
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| Place of production, publication, distribution, manufacture |
Boston, MA : |
| Name of producer, publisher, distributor, manufacturer |
Springer US, |
| Date of production, publication, distribution, manufacture, or copyright notice |
2006. |
| 300 ## - PHYSICAL DESCRIPTION |
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| Extent |
XIII, 292 p. |
| Other physical details |
online resource. |
| 336 ## - CONTENT TYPE |
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| Content type term |
text |
| Content type code |
txt |
| Source |
rdacontent |
| 337 ## - MEDIA TYPE |
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| Media type term |
computer |
| Media type code |
c |
| Source |
rdamedia |
| 338 ## - CARRIER TYPE |
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| Carrier type term |
recurso en línea |
| Carrier type code |
cr |
| Source |
rdacarrier |
| 347 ## - DIGITAL FILE CHARACTERISTICS |
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| File type |
text file |
| Encoding format |
PDF |
| Source |
rda |
| 505 0# - FORMATTED CONTENTS NOTE |
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| Formatted contents note |
Introduction: Context and motivations -- Introduction: Context and motivations -- Techniques and materials -- Silicon bulk micromachining with TMAH -- Thin dielectric films stress extraction -- Microsensors -- Low power microhotplate as basic cell -- Microheater based flow sensor -- Gas Sensors on microhotplate -- SOI-CMOS compatibility validation -- Conclusions and outlook -- Conclusions and outlook. |
| 520 ## - SUMMARY, ETC. |
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| Summary, etc. |
Co-integration of sensors with their associated electronics on a single silicon chip may provide many significant benefits regarding performance, reliability, miniaturization and process simplicity without significantly increasing the total cost. Micromachined Thin-Film Sensors for SOI-CMOS Co-integration covers the challenges and interests and demonstrates the successful co-integration of gas-flow sensors on dielectric membrane, with their associated electronics, in CMOS-SOI technology. We firstly investigate the extraction of residual stress in thin layers and in their stacking and the release, in post-processing, of a 1 µm-thick robust and flat dielectric multilayered membrane using Tetramethyl Ammonium Hydroxide (TMAH) silicon micromachining solution. The optimization of its selectivity towards aluminum is largely demonstrated. The second part focuses on sensors design and characteristics. A novel loop-shape polysilicon microheater is designed and built in a CMOS-SOI standard process. High thermal uniformity, low power consumption and high working temperature are confirmed by extensive measurements. The additional gas flow sensing layers are judiciously chosen and implemented. Measurements in the presence of a nitrogen flow and gas reveal fair sensitivity on a large flow velocity range as well as good response to many gases. Finally, MOS transistors suspended on released dielectric membranes are presented and fully characterized as a concluding demonstrator of the co-integration in SOI technology. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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ENGINEERING. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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PARTICLES (NUCLEAR PHYSICS). |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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PHYSICAL OPTICS. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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ELECTRONICS. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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SYSTEMS ENGINEERING. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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| Topical term or geographic name entry element |
SURFACES (PHYSICS). |
| 650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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| Topical term or geographic name entry element |
ENGINEERING. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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| Topical term or geographic name entry element |
PHYSICS AND APPLIED PHYSICS IN ENGINEERING. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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| Topical term or geographic name entry element |
ELECTRONICS AND MICROELECTRONICS, INSTRUMENTATION. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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| Topical term or geographic name entry element |
CIRCUITS AND SYSTEMS. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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| Topical term or geographic name entry element |
SOLID STATE PHYSICS AND SPECTROSCOPY. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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| Topical term or geographic name entry element |
APPLIED OPTICS, OPTOELECTRONICS, OPTICAL DEVICES. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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| Topical term or geographic name entry element |
SURFACES AND INTERFACES, THIN FILMS. |
| 700 1# - ADDED ENTRY--PERSONAL NAME |
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| Personal name |
Flandre, D. |
| Relator term |
author. |
| 700 1# - ADDED ENTRY--PERSONAL NAME |
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| Personal name |
Raskin, J. -P. |
| Relator term |
author. |
| 710 2# - ADDED ENTRY--CORPORATE NAME |
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| Corporate name or jurisdiction name as entry element |
SpringerLink (Online service) |
| 773 0# - HOST ITEM ENTRY |
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| Title |
Springer eBooks |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY |
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| Relationship information |
Printed edition: |
| International Standard Book Number |
9780387288420 |
| 856 40 - ELECTRONIC LOCATION AND ACCESS |
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| Uniform Resource Identifier |
<a href="http://dx.doi.org/10.1007/0-387-28843-0">http://dx.doi.org/10.1007/0-387-28843-0</a> |
| Public note |
Ver el texto completo en las instalaciones del CICY |
| 912 ## - |
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ZDB-2-ENG |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) |
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| Source of classification or shelving scheme |
Dewey Decimal Classification |
| Koha item type |
Libros electrónicos |
