Solder Joint Technology (Record no. 57607)

MARC details
000 -LEADER
fixed length control field 03248nam a22004935i 4500
001 - CONTROL NUMBER
control field 978-0-387-38892-2
003 - CONTROL NUMBER IDENTIFIER
control field DE-He213
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20250710083958.0
007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION
fixed length control field cr nn 008mamaa
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 100301s2007 xxu| s |||| 0|eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9780387388922
-- 99780387388922
024 7# - OTHER STANDARD IDENTIFIER
Standard number or code 10.1007/978-0-387-38892-2
Source of number or code doi
100 1# - MAIN ENTRY--PERSONAL NAME
Personal name Tu, King-Ning.
Relator term author.
245 10 - TITLE STATEMENT
Title Solder Joint Technology
Medium [recurso electrónico] :
Remainder of title Materials, Properties, and Reliability /
Statement of responsibility, etc. by King-Ning Tu.
264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE
Place of production, publication, distribution, manufacture New York, NY :
Name of producer, publisher, distributor, manufacturer Springer New York,
Date of production, publication, distribution, manufacture, or copyright notice 2007.
300 ## - PHYSICAL DESCRIPTION
Other physical details online resource.
336 ## - CONTENT TYPE
Content type term text
Content type code txt
Source rdacontent
337 ## - MEDIA TYPE
Media type term computer
Media type code c
Source rdamedia
338 ## - CARRIER TYPE
Carrier type term recurso en línea
Carrier type code cr
Source rdacarrier
347 ## - DIGITAL FILE CHARACTERISTICS
File type text file
Encoding format PDF
Source rda
490 1# - SERIES STATEMENT
Series statement Springer Series in Materials Science,
International Standard Serial Number 0933-033X ;
Volume/sequential designation 117
505 0# - FORMATTED CONTENTS NOTE
Formatted contents note Copper-Tin Reactions -- Copper-Tin Reactions in Bulk Samples -- Copper-Tin Reactions in Thin-Film Samples -- Copper-Tin Reactions in Flip Chip Solder Joints -- Kinetic Analysis of Flux-Driven Ripening of Copper-Tin Scallops -- Spontaneous Tin Whisker Growth: Mechanism and Prevention -- Solder Reactions on Nickel, Palladium, and Gold -- Electromigration and Thermomigration -- Fundamentals of Electromigration -- Electromigration in Flip Chip Solder Joints -- Polarity Effect of Electromigration on Solder Reactions -- Ductile-to-Brittle Transition of Solder Joints Affected by Copper-Tin Reaction and Electromigration -- Thermomigration.
520 ## - SUMMARY, ETC.
Summary, etc. Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element CHEMISTRY.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element MACHINERY.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element SYSTEM SAFETY.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element ELECTRONICS.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element OPTICAL MATERIALS.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element MATERIALS.
650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element CHEMISTRY.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element METALLIC MATERIALS.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element OPTICAL AND ELECTRONIC MATERIALS.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element QUALITY CONTROL, RELIABILITY, SAFETY AND RISK.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element MANUFACTURING, MACHINES, TOOLS.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element ELECTRONICS AND MICROELECTRONICS, INSTRUMENTATION.
710 2# - ADDED ENTRY--CORPORATE NAME
Corporate name or jurisdiction name as entry element SpringerLink (Online service)
773 0# - HOST ITEM ENTRY
Title Springer eBooks
776 08 - ADDITIONAL PHYSICAL FORM ENTRY
Relationship information Printed edition:
International Standard Book Number 9780387388908
830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE
Uniform title Springer Series in Materials Science,
International Standard Serial Number 0933-033X ;
Volume/sequential designation 117
856 40 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier <a href="http://dx.doi.org/10.1007/978-0-387-38892-2">http://dx.doi.org/10.1007/978-0-387-38892-2</a>
Public note Ver el texto completo en las instalaciones del CICY
912 ## -
-- ZDB-2-CMS
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Source of classification or shelving scheme Dewey Decimal Classification
Koha item type Libros electrónicos
Holdings
Lost status Source of classification or shelving scheme Damaged status Not for loan Collection Home library Current library Shelving location Date acquired Total checkouts Date last seen Price effective from Koha item type
  Dewey Decimal Classification     Libro electrónico CICY CICY Libro electrónico 10.07.2025   10.07.2025 10.07.2025 Libros electrónicos