MARC details
| 000 -LEADER |
| fixed length control field |
03248nam a22004935i 4500 |
| 001 - CONTROL NUMBER |
| control field |
978-0-387-38892-2 |
| 003 - CONTROL NUMBER IDENTIFIER |
| control field |
DE-He213 |
| 005 - DATE AND TIME OF LATEST TRANSACTION |
| control field |
20250710083958.0 |
| 007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION |
| fixed length control field |
cr nn 008mamaa |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
| fixed length control field |
100301s2007 xxu| s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
| International Standard Book Number |
9780387388922 |
| -- |
99780387388922 |
| 024 7# - OTHER STANDARD IDENTIFIER |
| Standard number or code |
10.1007/978-0-387-38892-2 |
| Source of number or code |
doi |
| 100 1# - MAIN ENTRY--PERSONAL NAME |
| Personal name |
Tu, King-Ning. |
| Relator term |
author. |
| 245 10 - TITLE STATEMENT |
| Title |
Solder Joint Technology |
| Medium |
[recurso electrónico] : |
| Remainder of title |
Materials, Properties, and Reliability / |
| Statement of responsibility, etc. |
by King-Ning Tu. |
| 264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE |
| Place of production, publication, distribution, manufacture |
New York, NY : |
| Name of producer, publisher, distributor, manufacturer |
Springer New York, |
| Date of production, publication, distribution, manufacture, or copyright notice |
2007. |
| 300 ## - PHYSICAL DESCRIPTION |
| Other physical details |
online resource. |
| 336 ## - CONTENT TYPE |
| Content type term |
text |
| Content type code |
txt |
| Source |
rdacontent |
| 337 ## - MEDIA TYPE |
| Media type term |
computer |
| Media type code |
c |
| Source |
rdamedia |
| 338 ## - CARRIER TYPE |
| Carrier type term |
recurso en línea |
| Carrier type code |
cr |
| Source |
rdacarrier |
| 347 ## - DIGITAL FILE CHARACTERISTICS |
| File type |
text file |
| Encoding format |
PDF |
| Source |
rda |
| 490 1# - SERIES STATEMENT |
| Series statement |
Springer Series in Materials Science, |
| International Standard Serial Number |
0933-033X ; |
| Volume/sequential designation |
117 |
| 505 0# - FORMATTED CONTENTS NOTE |
| Formatted contents note |
Copper-Tin Reactions -- Copper-Tin Reactions in Bulk Samples -- Copper-Tin Reactions in Thin-Film Samples -- Copper-Tin Reactions in Flip Chip Solder Joints -- Kinetic Analysis of Flux-Driven Ripening of Copper-Tin Scallops -- Spontaneous Tin Whisker Growth: Mechanism and Prevention -- Solder Reactions on Nickel, Palladium, and Gold -- Electromigration and Thermomigration -- Fundamentals of Electromigration -- Electromigration in Flip Chip Solder Joints -- Polarity Effect of Electromigration on Solder Reactions -- Ductile-to-Brittle Transition of Solder Joints Affected by Copper-Tin Reaction and Electromigration -- Thermomigration. |
| 520 ## - SUMMARY, ETC. |
| Summary, etc. |
Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
CHEMISTRY. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
MACHINERY. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
SYSTEM SAFETY. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
ELECTRONICS. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
OPTICAL MATERIALS. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
MATERIALS. |
| 650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
CHEMISTRY. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
METALLIC MATERIALS. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
OPTICAL AND ELECTRONIC MATERIALS. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
QUALITY CONTROL, RELIABILITY, SAFETY AND RISK. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
MANUFACTURING, MACHINES, TOOLS. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
ELECTRONICS AND MICROELECTRONICS, INSTRUMENTATION. |
| 710 2# - ADDED ENTRY--CORPORATE NAME |
| Corporate name or jurisdiction name as entry element |
SpringerLink (Online service) |
| 773 0# - HOST ITEM ENTRY |
| Title |
Springer eBooks |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY |
| Relationship information |
Printed edition: |
| International Standard Book Number |
9780387388908 |
| 830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE |
| Uniform title |
Springer Series in Materials Science, |
| International Standard Serial Number |
0933-033X ; |
| Volume/sequential designation |
117 |
| 856 40 - ELECTRONIC LOCATION AND ACCESS |
| Uniform Resource Identifier |
<a href="http://dx.doi.org/10.1007/978-0-387-38892-2">http://dx.doi.org/10.1007/978-0-387-38892-2</a> |
| Public note |
Ver el texto completo en las instalaciones del CICY |
| 912 ## - |
| -- |
ZDB-2-CMS |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) |
| Source of classification or shelving scheme |
Dewey Decimal Classification |
| Koha item type |
Libros electrónicos |