MARC details
| 000 -LEADER |
| fixed length control field |
03115nam a22004815i 4500 |
| 001 - CONTROL NUMBER |
| control field |
978-0-387-68422-2 |
| 003 - CONTROL NUMBER IDENTIFIER |
| control field |
DE-He213 |
| 005 - DATE AND TIME OF LATEST TRANSACTION |
| control field |
20250710084006.0 |
| 007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION |
| fixed length control field |
cr nn 008mamaa |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
| fixed length control field |
100301s2007 xxu| s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
| International Standard Book Number |
9780387684222 |
| -- |
99780387684222 |
| 024 7# - OTHER STANDARD IDENTIFIER |
| Standard number or code |
10.1007/978-0-387-68422-2 |
| Source of number or code |
doi |
| 082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER |
| Classification number |
621.381 |
| Edition information |
23 |
| 100 1# - MAIN ENTRY--PERSONAL NAME |
| Personal name |
Bath, Jasbir. |
| Relator term |
editor. |
| 245 10 - TITLE STATEMENT |
| Title |
Lead-Free Soldering |
| Medium |
[recurso electrónico] / |
| Statement of responsibility, etc. |
edited by Jasbir Bath. |
| 264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE |
| Place of production, publication, distribution, manufacture |
Boston, MA : |
| Name of producer, publisher, distributor, manufacturer |
Springer US, |
| Date of production, publication, distribution, manufacture, or copyright notice |
2007. |
| 300 ## - PHYSICAL DESCRIPTION |
| Other physical details |
online resource. |
| 336 ## - CONTENT TYPE |
| Content type term |
text |
| Content type code |
txt |
| Source |
rdacontent |
| 337 ## - MEDIA TYPE |
| Media type term |
computer |
| Media type code |
c |
| Source |
rdamedia |
| 338 ## - CARRIER TYPE |
| Carrier type term |
recurso en línea |
| Carrier type code |
cr |
| Source |
rdacarrier |
| 347 ## - DIGITAL FILE CHARACTERISTICS |
| File type |
text file |
| Encoding format |
PDF |
| Source |
rda |
| 505 0# - FORMATTED CONTENTS NOTE |
| Formatted contents note |
Lead Restrictions and Other Regulatory Influences on the Electronics Industry -- Fundamental Properties of Pb-Free Solder Alloys -- Lead-Free Surface Mount Assembly -- Lead-Free Wave Soldering -- Lead-Free Rework -- Lead-Free Solder Joint Reliability -- Backward and Forward Compatibility -- PCB Laminates -- Lead-Free Board Surface Finishes -- Lead-Free Soldering Standards. |
| 520 ## - SUMMARY, ETC. |
| Summary, etc. |
The push toward lead-free soldering in computers, cell phones and other electronic and electrical devices has taken on a greater urgency as laws have been passed or are pending in the United States, the European Union and Asia which ban lead-bearing solder. These new restrictions on hazardous substances are changing the way electronic devices are assembled, and specifically affect process engineering, manufacturing and quality assurance. Lead-Free Soldering offers in a single volume a broad collection of practical techniques for lead-free soldering design and manufacture, which up to now have been scattered in difficult-to-find scholarly sources. The book includes the latest information on proposed changes to lead-free standards, and up-to-date analysis of government and legislative activities and regulations in North America, Europe and Asia. Written by recognized experts in both academia and industry, Lead-Free Soldering is a must-have guide for practicing engineers interested in the latest developments surrounding areas such as lead-free alloy properties, reflow, wave, rework , solder joint reliability, PCB laminates and surface finishes, and backward and forward compatibility. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
ENGINEERING. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
ELECTRONICS. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
SYSTEMS ENGINEERING. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
ENVIRONMENTAL LAW. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
OPTICAL MATERIALS. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
MATERIALS. |
| 650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
ENGINEERING. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
ELECTRONICS AND MICROELECTRONICS, INSTRUMENTATION. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
METALLIC MATERIALS. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
CIRCUITS AND SYSTEMS. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
OPTICAL AND ELECTRONIC MATERIALS. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
ENVIRONMENTAL LAW/POLICY/ECOJUSTICE. |
| 710 2# - ADDED ENTRY--CORPORATE NAME |
| Corporate name or jurisdiction name as entry element |
SpringerLink (Online service) |
| 773 0# - HOST ITEM ENTRY |
| Title |
Springer eBooks |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY |
| Relationship information |
Printed edition: |
| International Standard Book Number |
9780387324661 |
| 856 40 - ELECTRONIC LOCATION AND ACCESS |
| Uniform Resource Identifier |
<a href="http://dx.doi.org/10.1007/978-0-387-68422-2">http://dx.doi.org/10.1007/978-0-387-68422-2</a> |
| Public note |
Ver el texto completo en las instalaciones del CICY |
| 912 ## - |
| -- |
ZDB-2-ENG |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) |
| Source of classification or shelving scheme |
Dewey Decimal Classification |
| Koha item type |
Libros electrónicos |