MARC details
| 000 -LEADER |
| fixed length control field |
03452nam a22004575i 4500 |
| 001 - CONTROL NUMBER |
| control field |
978-0-387-69010-0 |
| 003 - CONTROL NUMBER IDENTIFIER |
| control field |
DE-He213 |
| 005 - DATE AND TIME OF LATEST TRANSACTION |
| control field |
20250710084009.0 |
| 007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION |
| fixed length control field |
cr nn 008mamaa |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
| fixed length control field |
100301s2009 xxu| s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
| International Standard Book Number |
9780387690100 |
| -- |
99780387690100 |
| 024 7# - OTHER STANDARD IDENTIFIER |
| Standard number or code |
10.1007/978-0-387-69010-0 |
| Source of number or code |
doi |
| 082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER |
| Classification number |
621.3815 |
| Edition information |
23 |
| 100 1# - MAIN ENTRY--PERSONAL NAME |
| Personal name |
El-Kareh, Badih. |
| Relator term |
author. |
| 245 10 - TITLE STATEMENT |
| Title |
Silicon Devices and Process Integration |
| Medium |
[recurso electrónico] : |
| Remainder of title |
Deep Submicron and Nano-Scale Technologies / |
| Statement of responsibility, etc. |
by Badih El-Kareh. |
| 264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE |
| Place of production, publication, distribution, manufacture |
Boston, MA : |
| Name of producer, publisher, distributor, manufacturer |
Springer US, |
| Date of production, publication, distribution, manufacture, or copyright notice |
2009. |
| 300 ## - PHYSICAL DESCRIPTION |
| Other physical details |
online resource. |
| 336 ## - CONTENT TYPE |
| Content type term |
text |
| Content type code |
txt |
| Source |
rdacontent |
| 337 ## - MEDIA TYPE |
| Media type term |
computer |
| Media type code |
c |
| Source |
rdamedia |
| 338 ## - CARRIER TYPE |
| Carrier type term |
recurso en línea |
| Carrier type code |
cr |
| Source |
rdacarrier |
| 347 ## - DIGITAL FILE CHARACTERISTICS |
| File type |
text file |
| Encoding format |
PDF |
| Source |
rda |
| 505 0# - FORMATTED CONTENTS NOTE |
| Formatted contents note |
Properties of the Silicon Crystal. Valence-bond and energy-band models. Thermal equilibrium statistics. Carrier transport mechanisms. Non-equilibrium conditions and carrier lifetime -- Junctions and Contacts. Ohmic, non-ohmic, and rectifying contacts. PN junctions, homo- and hetero-junctions. Contact und junction characterization, parameter extraction. Varactors -- Junction Field-Effect Transistor, JFET. Structure and mode of operation. Physics of JFET. JFET characterization and parameter extraction. High-voltage applications. Parasitic effects -- Bipolar Junction Transistor, BJT. Structure and mode of operation. Physics of BJT. Heterojunction Bipolar Transistor, HBT. Transistor characterization and parameter extraction. High-voltage applications -- Parasitic effects. |
| 520 ## - SUMMARY, ETC. |
| Summary, etc. |
Silicon Devices and Process Integration is compiled from industrial and academic lecture notes and reflects years of experience in the development of silicon devices. It is prepared specifically for engineers and scientists in semiconductor research, development and manufacturing. It is also suitable for a one-semester course in electrical engineering and materials science at the upper undergraduate or lower graduate level. The book covers both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. Topics covered include: MOS structure, parameter extraction - Short and narrow-channel effects - CMOS mobility enhancement techniques - High-K gate dielectrics, advanced gate stacks - Low-K dielectrics and Cu interconnects - Analog devices and passive components - CMOS and BiCMOS process integration - DRAM, SRAM and NVM cell structures. The book covers state-of-the-art silicon devices and integrated process technologies. It represents a comprehensive discussion of modern silicon devices, their characteristics, and interactions with process parameters. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
ENGINEERING. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
COMPUTER ENGINEERING. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
ELECTRONICS. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
SYSTEMS ENGINEERING. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
MATERIALS. |
| 650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
ENGINEERING. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
CIRCUITS AND SYSTEMS. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
ELECTRONICS AND MICROELECTRONICS, INSTRUMENTATION. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
ELECTRICAL ENGINEERING. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
| Topical term or geographic name entry element |
MATERIALS SCIENCE, GENERAL. |
| 710 2# - ADDED ENTRY--CORPORATE NAME |
| Corporate name or jurisdiction name as entry element |
SpringerLink (Online service) |
| 773 0# - HOST ITEM ENTRY |
| Title |
Springer eBooks |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY |
| Relationship information |
Printed edition: |
| International Standard Book Number |
9780387367989 |
| 856 40 - ELECTRONIC LOCATION AND ACCESS |
| Uniform Resource Identifier |
<a href="http://dx.doi.org/10.1007/978-0-387-69010-0">http://dx.doi.org/10.1007/978-0-387-69010-0</a> |
| Public note |
Ver el texto completo en las instalaciones del CICY |
| 912 ## - |
| -- |
ZDB-2-ENG |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) |
| Source of classification or shelving scheme |
Dewey Decimal Classification |
| Koha item type |
Libros electrónicos |