MARC details
| 000 -LEADER |
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| fixed length control field |
04831nam a22005175i 4500 |
| 001 - CONTROL NUMBER |
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| control field |
978-0-387-95868-2 |
| 003 - CONTROL NUMBER IDENTIFIER |
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| control field |
DE-He213 |
| 005 - DATE AND TIME OF LATEST TRANSACTION |
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| control field |
20251006084432.0 |
| 007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION |
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| fixed length control field |
cr nn 008mamaa |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
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| fixed length control field |
100301s2009 xxu| s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
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| International Standard Book Number |
9780387958682 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
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| International Standard Book Number |
99780387958682 |
| 024 7# - OTHER STANDARD IDENTIFIER |
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| Standard number or code |
10.1007/978-0-387-95868-2 |
| Source of number or code |
doi |
| 082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER |
|---|
| Classification number |
541.37 |
| Edition information |
23 |
| 100 1# - MAIN ENTRY--PERSONAL NAME |
|---|
| Personal name |
Shacham-Diamand, Yosi. |
| Relator term |
editor. |
| 245 10 - TITLE STATEMENT |
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| Title |
Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications |
| Medium |
[electronic resource] / |
| Statement of responsibility, etc. |
edited by Yosi Shacham-Diamand, Tetsuya Osaka, Madhav Datta, Takayuki Ohba. |
| 264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE |
|---|
| Place of production, publication, distribution, manufacture |
New York, NY : |
| Name of producer, publisher, distributor, manufacturer |
Springer New York, |
| Date of production, publication, distribution, manufacture, or copyright notice |
2009. |
| 300 ## - PHYSICAL DESCRIPTION |
|---|
| Other physical details |
online resource. |
| 336 ## - CONTENT TYPE |
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| Content type term |
text |
| Content type code |
txt |
| Source |
rdacontent |
| 337 ## - MEDIA TYPE |
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| Media type term |
computer |
| Media type code |
c |
| Source |
rdamedia |
| 338 ## - CARRIER TYPE |
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| Carrier type term |
online resource |
| Carrier type code |
cr |
| Source |
rdacarrier |
| 347 ## - DIGITAL FILE CHARACTERISTICS |
|---|
| File type |
text file |
| Encoding format |
PDF |
| Source |
rda |
| 505 0# - FORMATTED CONTENTS NOTE |
|---|
| Formatted contents note |
Challenges in ULSI Interconnects - Introduction to the Book -- Technology Background -- MOS Device and Interconnects Scaling Physics -- Interconnects in ULSI Systems: Cu Interconnects Electrical Performance -- Electrodeposition -- Electrophoretic Deposition -- Wafer-Level 3D Integration for ULSI Interconnects -- Interconnect Materials -- Diffusion Barriers for Ultra-Large-Scale Integrated Copper Metallization -- Silicides -- Materials for ULSI metallization - Overview of Electrical Properties -- Low-? Materials and Development Trends -- Electrical and Mechanical Characteristics of Air-Bridge Cu Interconnects -- ALD Seed Layers for Plating and Electroless Plating -- Deposition Processes for ULSI Interconnects -- Electrochemical Processes for ULSI Interconnects -- Atomic Layer Deposition (ALD) Processes for ULSI Manufacturing -- Electroless Deposition Approaching the Molecular Scale -- Modeling -- Modeling Superconformal Electrodeposition Using an Open Source PDE Solver -- Electrochemical Process Integration -- to Electrochemical Process Integration for Cu Interconnects -- Damascene Concept and Process Steps -- Advanced BEOL Technology Overview -- Lithography for Cu Damascene Fabrication -- Physical Vapor Deposition Barriers for Cu metallization - PVD Barriers -- Low-k Dielectrics -- CMP for Cu Processing -- Electrochemical View of Copper Chemical-Mechanical Polishing (CMP) -- Copper Post-CMP Cleaning -- Electrochemical Processes and Tools -- Electrochemical Processing Tools for Advanced Copper Interconnects: An Introduction -- Electrochemical Deposition Processes and Tools -- Electroless Deposition Processes and Tools -- Tools for Monitoring and Control of Bath Components -- Processes and Tools for Co Alloy Capping -- Advanced Planarization Techniques -- Metrology -- Integrated Metrology (IM) History at a Glance -- Thin Film Metrology - X-ray Methods -- Summary and Foresight -- Emerging Nanoscale Interconnect Processing Technologies: Fundamental and Practice -- Self-Assembly of Short Aromatic Peptides: From Amyloid Fibril Formation to Nanotechnology. |
| 520 ## - SUMMARY, ETC. |
|---|
| Summary, etc. |
Advanced Nanoscale ULSI Interconnects: Fundamental and Applications brings a comprehensive description of copper based interconnect technology for Ultra Large Scale Integration (ULSI) technology to Integrated Circuit (ICs) application. This book reviews the basic technologies used today for the copper metallization of ULSI applications: deposition and planarization. It describes the materials used, their properties, and the way they are all integrated, specifically in regard to the copper integration processes and electrochemical processes in the nanoscale regime. The book also presents various novel nanoscale technologies that will link modern nanoscale electronics to future nanoscale based systems. This diverse, multidisciplinary volume will appeal to process engineers in the microelectronics industry; universities with programs in ULSI design, microelectronics, MEMS and nanoelectronics; and professionals in the electrochemical industry working with materials, plating and tool vendors. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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| Topical term or geographic name entry element |
CHEMISTRY. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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| Topical term or geographic name entry element |
CHEMICAL ENGINEERING. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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| Topical term or geographic name entry element |
COMPUTER ENGINEERING. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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| Topical term or geographic name entry element |
MATERIALS. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
NANOTECHNOLOGY. |
| 650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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| Topical term or geographic name entry element |
CHEMISTRY. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
ELECTROCHEMISTRY. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
MATERIALS SCIENCE, GENERAL. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
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| Topical term or geographic name entry element |
INDUSTRIAL CHEMISTRY/CHEMICAL ENGINEERING. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
ELECTRICAL ENGINEERING. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
NANOTECHNOLOGY. |
| 700 1# - ADDED ENTRY--PERSONAL NAME |
|---|
| Personal name |
Osaka, Tetsuya. |
| Relator term |
editor. |
| 700 1# - ADDED ENTRY--PERSONAL NAME |
|---|
| Personal name |
Datta, Madhav. |
| Relator term |
editor. |
| 700 1# - ADDED ENTRY--PERSONAL NAME |
|---|
| Personal name |
Ohba, Takayuki. |
| Relator term |
editor. |
| 710 2# - ADDED ENTRY--CORPORATE NAME |
|---|
| Corporate name or jurisdiction name as entry element |
SpringerLink (Online service) |
| 773 0# - HOST ITEM ENTRY |
|---|
| Title |
Springer eBooks |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY |
|---|
| Relationship information |
Printed edition: |
| International Standard Book Number |
9780387958675 |
| 856 40 - ELECTRONIC LOCATION AND ACCESS |
|---|
| Uniform Resource Identifier |
<a href="http://dx.doi.org/10.1007/978-0-387-95868-2">http://dx.doi.org/10.1007/978-0-387-95868-2</a> |
| Public note |
Ver el texto completo en las instalaciones del CICY |
| 912 ## - |
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| -- |
ZDB-2-CMS |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) |
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| Source of classification or shelving scheme |
Dewey Decimal Classification |
| Koha item type |
Libros electrónicos |
