Polymeric materials for electronics packaging and interconnection / John H. Lupinski and Robert S. Moore, [editors]

Tipo de material: Texto

TextoSeries ACS Symposium Series ; 407Editor: Washington, D.C. : American Chemical Society, 1989Descripción: xi, 499 p. : il. ; 23 cmISBN:

0841216797

Trabajos contenidos:

Lupinski, John H., 1927- [ed.]
Moore, Robert S., 1933- [ed.]
American Chemical Society. Division of Polymeric Materials

Tema(s):

Clasificación CDD:

621.381 P6 1989

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Item type	Current library	Collection	Call number	Status	Date due	Barcode
Libros impresos	CICY Colección general	Colección general	621.381 P6 1989 (Browse shelf(Opens below))	Available		4378

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Previous	621.381 D2l 1989 D.A.T.A. digest update : linear integrated circuits	621.381 D2l 1989 D.A.T.A. digest update : linear integrated circuits	621.381 L58 2012 Foundations of MEMS /	621.381 P6 1989 Polymeric materials for electronics packaging and interconnection /	621.38152 P4 1986 The Physics and fabrication of microstructures and microdevices : proceedings of the winter school, Les Houches, France, March 25-April 5, 1986 /	621.384134 D3 1990 D.A.T.A. digest. Discrete semiconductors : transistors	621.384134 D38 1990 D.A.T.A. digest : suggested replacement alternate sources discrete semiconductors	Next

Developed from a symposium sponsored by the Divisions of Polymeric Materials: Science and Engineering and of Polymer Chemistry, Inc. at the 196th National Meeting of the American Chemical Society, Los Angeles, California, September 25-30, 1988.

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