Polymeric materials for electronics packaging and interconnection / 
John H. Lupinski and Robert S. Moore, [editors] 
 - xi, 499 p. :  il. ;  23 cm. 
 - ACS Symposium Series ;  407 .
<br/><br/> Developed from a symposium sponsored by the Divisions of Polymeric Materials: Science and Engineering and of Polymer Chemistry, Inc. at the 196th National Meeting of the American Chemical Society, Los Angeles, California, September 25-30, 1988. 
<br/><br/>Incluye referencias bibliográficas 
<br/><br/><label>ISBN: </label>0841216797 
<br/><br/><label>Subjects--Topical Terms: </label><br/>ELECTRONICA--CONGRESOS, CONFERENCIAS, ETC.<br/>POLIMEROS--CONGRESOS, CONFERENCIAS, ETC.
<br/><br/><label>Dewey Class. No.: </label>621.381  / P6 1989