TY  - BOOK
AU  - Lupinski,John H.
AU  - Moore,Robert S.
ED  - American Chemical Society. 
TI  - Polymeric materials for electronics packaging and interconnection
T2  - ACS Symposium Series
SN  - 0841216797
U1  - 621.381 
PY  - 1989///
CY  - Washington, D.C.
PB  - American Chemical Society, 
KW  - ELECTRONICA
KW  - CONGRESOS, CONFERENCIAS, ETC
KW  - POLIMEROS
N1  - Developed from a symposium sponsored by the Divisions of Polymeric Materials: Science and Engineering and of Polymer Chemistry, Inc. at the 196th National Meeting of the American Chemical Society, Los Angeles, California, September 25-30, 1988; Incluye referencias bibliográficas
ER  -