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040			_cCICY
082	0	4	_a621.381 _bP6 1989
245	1	0	_aPolymeric materials for electronics packaging and interconnection / _cJohn H. Lupinski and Robert S. Moore, [editors]
264	3	1	_aWashington, D.C. : _bAmerican Chemical Society, _c1989
300			_axi, 499 p. : _bil. ; _c23 cm.
490	0		_aACS Symposium Series ; _v407
500			_aDeveloped from a symposium sponsored by the Divisions of Polymeric Materials: Science and Engineering and of Polymer Chemistry, Inc. at the 196th National Meeting of the American Chemical Society, Los Angeles, California, September 25-30, 1988.
504			_aIncluye referencias bibliográficas
650	1	4	_aELECTRONICA _vCONGRESOS, CONFERENCIAS, ETC.
650	1	4	_aPOLIMEROS _vCONGRESOS, CONFERENCIAS, ETC.
700	1	2	_aLupinski, John H., _d1927-, _eed.
700	1	2	_aMoore, Robert S., _d1933-, _eed.
710	1	2	_aAmerican Chemical Society. _bDivision of Polymeric Materials.
942			_2ddc _cBK
999			_c3000 _d3000