000			03621nam a22004815i 4500
001			978-0-387-29749-1
003			DE-He213
005			20250710083945.0
007			cr nn 008mamaa
008			100301s2006 xxu| s |||| 0|eng d
020			_a9780387297491 _a99780387297491
024	7		_a10.1007/0-387-29749-9 _2doi
082	0	4	_a621.3815 _223
100	1		_aVassighi, Arman. _eauthor.
245	1	0	_aThermal and Power Management of Integrated Circuits _h[recurso electrónico] / _cby Arman Vassighi, Manoj Sachdev.
264		1	_aBoston, MA : _bSpringer US, _c2006.
300			_aX, 179 p. _bonline resource.
336			_atext _btxt _2rdacontent
337			_acomputer _bc _2rdamedia
338			_arecurso en línea _bcr _2rdacarrier
347			_atext file _bPDF _2rda
490	1		_aSeries on Integrated Circuits and Systems, _x1558-9412
505	0		_aPower, Junction Temperature, and Reliability -- Burn-in as a Reliability Screening Test -- Thermal and Electrothermal Modeling -- Thermal Runaway and Thermal Management -- Low Temperature CMOS Operation.
520			_aThermal modeling of high performance circuits and systems is a crucial component for thermal and power management. The VLSI community is currently lacking a methodology to model and estimate junction temperature at any level of design other than low-level (transistor-level) circuits. The accuracy of thermal modeling has a substantial effect on the accuracy of thermal-management studies at the architectural level. Without this essential modeling capability, architecture researchers are limited to inaccurate estimation techniques, which are not suitable for thermal management of integrated circuits. In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.
650		0	_aENGINEERING.
650		0	_aCOMPUTER AIDED DESIGN.
650		0	_aENGINEERING DESIGN.
650		0	_aSYSTEMS ENGINEERING.
650	1	4	_aENGINEERING.
650	2	4	_aCIRCUITS AND SYSTEMS.
650	2	4	_aENGINEERING DESIGN.
650	2	4	_aCOMPUTER-AIDED ENGINEERING (CAD, CAE) AND DESIGN.
650	2	4	_aELECTRONIC AND COMPUTER ENGINEERING.
700	1		_aSachdev, Manoj. _eauthor.
710	2		_aSpringerLink (Online service)
773	0		_tSpringer eBooks
776	0	8	_iPrinted edition: _z9780387257624
830		0	_aSeries on Integrated Circuits and Systems, _x1558-9412
856	4	0	_uhttp://dx.doi.org/10.1007/0-387-29749-9 _zVer el texto completo en las instalaciones del CICY
912			_aZDB-2-ENG
942			_2ddc _cER
999			_c56985 _d56985