000			03248nam a22004935i 4500
001			978-0-387-38892-2
003			DE-He213
005			20250710083958.0
007			cr nn 008mamaa
008			100301s2007 xxu| s |||| 0|eng d
020			_a9780387388922 _a99780387388922
024	7		_a10.1007/978-0-387-38892-2 _2doi
100	1		_aTu, King-Ning. _eauthor.
245	1	0	_aSolder Joint Technology _h[recurso electrónico] : _bMaterials, Properties, and Reliability / _cby King-Ning Tu.
264		1	_aNew York, NY : _bSpringer New York, _c2007.
300			_bonline resource.
336			_atext _btxt _2rdacontent
337			_acomputer _bc _2rdamedia
338			_arecurso en línea _bcr _2rdacarrier
347			_atext file _bPDF _2rda
490	1		_aSpringer Series in Materials Science, _x0933-033X ; _v117
505	0		_aCopper-Tin Reactions -- Copper-Tin Reactions in Bulk Samples -- Copper-Tin Reactions in Thin-Film Samples -- Copper-Tin Reactions in Flip Chip Solder Joints -- Kinetic Analysis of Flux-Driven Ripening of Copper-Tin Scallops -- Spontaneous Tin Whisker Growth: Mechanism and Prevention -- Solder Reactions on Nickel, Palladium, and Gold -- Electromigration and Thermomigration -- Fundamentals of Electromigration -- Electromigration in Flip Chip Solder Joints -- Polarity Effect of Electromigration on Solder Reactions -- Ductile-to-Brittle Transition of Solder Joints Affected by Copper-Tin Reaction and Electromigration -- Thermomigration.
520			_aSolder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.
650		0	_aCHEMISTRY.
650		0	_aMACHINERY.
650		0	_aSYSTEM SAFETY.
650		0	_aELECTRONICS.
650		0	_aOPTICAL MATERIALS.
650		0	_aMATERIALS.
650	1	4	_aCHEMISTRY.
650	2	4	_aMETALLIC MATERIALS.
650	2	4	_aOPTICAL AND ELECTRONIC MATERIALS.
650	2	4	_aQUALITY CONTROL, RELIABILITY, SAFETY AND RISK.
650	2	4	_aMANUFACTURING, MACHINES, TOOLS.
650	2	4	_aELECTRONICS AND MICROELECTRONICS, INSTRUMENTATION.
710	2		_aSpringerLink (Online service)
773	0		_tSpringer eBooks
776	0	8	_iPrinted edition: _z9780387388908
830		0	_aSpringer Series in Materials Science, _x0933-033X ; _v117
856	4	0	_uhttp://dx.doi.org/10.1007/978-0-387-38892-2 _zVer el texto completo en las instalaciones del CICY
912			_aZDB-2-CMS
942			_2ddc _cER
999			_c57607 _d57607