000			03115nam a22004815i 4500
001			978-0-387-68422-2
003			DE-He213
005			20250710084006.0
007			cr nn 008mamaa
008			100301s2007 xxu| s |||| 0|eng d
020			_a9780387684222 _a99780387684222
024	7		_a10.1007/978-0-387-68422-2 _2doi
082	0	4	_a621.381 _223
100	1		_aBath, Jasbir. _eeditor.
245	1	0	_aLead-Free Soldering _h[recurso electrónico] / _cedited by Jasbir Bath.
264		1	_aBoston, MA : _bSpringer US, _c2007.
300			_bonline resource.
336			_atext _btxt _2rdacontent
337			_acomputer _bc _2rdamedia
338			_arecurso en línea _bcr _2rdacarrier
347			_atext file _bPDF _2rda
505	0		_aLead Restrictions and Other Regulatory Influences on the Electronics Industry -- Fundamental Properties of Pb-Free Solder Alloys -- Lead-Free Surface Mount Assembly -- Lead-Free Wave Soldering -- Lead-Free Rework -- Lead-Free Solder Joint Reliability -- Backward and Forward Compatibility -- PCB Laminates -- Lead-Free Board Surface Finishes -- Lead-Free Soldering Standards.
520			_aThe push toward lead-free soldering in computers, cell phones and other electronic and electrical devices has taken on a greater urgency as laws have been passed or are pending in the United States, the European Union and Asia which ban lead-bearing solder. These new restrictions on hazardous substances are changing the way electronic devices are assembled, and specifically affect process engineering, manufacturing and quality assurance. Lead-Free Soldering offers in a single volume a broad collection of practical techniques for lead-free soldering design and manufacture, which up to now have been scattered in difficult-to-find scholarly sources. The book includes the latest information on proposed changes to lead-free standards, and up-to-date analysis of government and legislative activities and regulations in North America, Europe and Asia. Written by recognized experts in both academia and industry, Lead-Free Soldering is a must-have guide for practicing engineers interested in the latest developments surrounding areas such as lead-free alloy properties, reflow, wave, rework , solder joint reliability, PCB laminates and surface finishes, and backward and forward compatibility.
650		0	_aENGINEERING.
650		0	_aELECTRONICS.
650		0	_aSYSTEMS ENGINEERING.
650		0	_aENVIRONMENTAL LAW.
650		0	_aOPTICAL MATERIALS.
650		0	_aMATERIALS.
650	1	4	_aENGINEERING.
650	2	4	_aELECTRONICS AND MICROELECTRONICS, INSTRUMENTATION.
650	2	4	_aMETALLIC MATERIALS.
650	2	4	_aCIRCUITS AND SYSTEMS.
650	2	4	_aOPTICAL AND ELECTRONIC MATERIALS.
650	2	4	_aENVIRONMENTAL LAW/POLICY/ECOJUSTICE.
710	2		_aSpringerLink (Online service)
773	0		_tSpringer eBooks
776	0	8	_iPrinted edition: _z9780387324661
856	4	0	_uhttp://dx.doi.org/10.1007/978-0-387-68422-2 _zVer el texto completo en las instalaciones del CICY
912			_aZDB-2-ENG
942			_2ddc _cER
999			_c57967 _d57967