000			03605nam a22004815i 4500
001			978-0-387-78219-5
003			DE-He213
005			20251006084418.0
007			cr nn 008mamaa
008			100301s2009 xxu| s |||| 0|eng d
020			_a9780387782195
020			_a99780387782195
024	7		_a10.1007/978-0-387-78219-5 _2doi
082	0	4	_a620.11295 _223
082	0	4	_a620.11297 _223
100	1		_aLu, Daniel. _eeditor.
245	1	0	_aMaterials for Advanced Packaging _h[electronic resource] / _cedited by Daniel Lu, C.P. Wong.
264		1	_aBoston, MA : _bSpringer US, _c2009.
300			_bonline resource.
336			_atext _btxt _2rdacontent
337			_acomputer _bc _2rdamedia
338			_aonline resource _bcr _2rdacarrier
347			_atext file _bPDF _2rda
505	0		_a3D Integration Technologies - An Overview -- Advanced Bonding/Joining Techniques -- Advanced Chip-to-Substrate Connections -- Advanced Wire Bonding Technology: Materials, Methods, and Testing -- Lead-Free Soldering -- Thin Die Production -- Advanced Substrates: A Materials and Processing Perspective -- Advanced Print Circuit Board Materials -- Flip-Chip Underfill: Materials, Process and Reliability -- Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips -- Electrically Conductive Adhesives (ECAs) -- Die Attach Adhesives and Films -- Thermal Interface Materials -- Embedded Passives -- Nanomaterials and Nanopackaging -- Wafer Level Chip Scale Packaging -- Microelectromechanical Systems and Packaging -- LED and Optical Device Packaging and Materials -- Digital Health and Bio-Medical Packaging.
520			_aSignificant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. Materials for Advanced Packaging provides a comprehensive review on the most recent developments in advanced packaging technologies including emerging technologies such as 3 dimensional (3D), nanopackaging, and biomedical packaging with a focus on materials and processing aspects. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging including: New bonding and joining techniques Novel approaches to make electrical interconnects between integrated circuit (IC) and substrates Latest advances in packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives. Materials and processing aspects on MEMS and wafer level chip scale packaging. Written by experts in the field of materials and packaging, Materials for Advanced Packaging is a must have book for professionals in semiconductor, digital health and bio-medical areas, and graduate students studying materials science and engineering.
650		0	_aELECTRONICS.
650		0	_aOPTICAL MATERIALS.
650		0	_aNANOTECHNOLOGY.
650		0	_aMATERIALS.
650	1	4	_aMATERIALS SCIENCE.
650	2	4	_aOPTICAL AND ELECTRONIC MATERIALS.
650	2	4	_aMETALLIC MATERIALS.
650	2	4	_aNANOTECHNOLOGY.
650	2	4	_aELECTRONICS AND MICROELECTRONICS, INSTRUMENTATION.
700	1		_aWong, C.P. _eeditor.
710	2		_aSpringerLink (Online service)
773	0		_tSpringer eBooks
776	0	8	_iPrinted edition: _z9780387782188
856	4	0	_uhttp://dx.doi.org/10.1007/978-0-387-78219-5 _zVer el texto completo en las instalaciones del CICY
912			_aZDB-2-CMS
942			_2ddc _cER
999			_c59060 _d59060