000			04831nam a22005175i 4500
001			978-0-387-95868-2
003			DE-He213
005			20251006084432.0
007			cr nn 008mamaa
008			100301s2009 xxu| s |||| 0|eng d
020			_a9780387958682
020			_a99780387958682
024	7		_a10.1007/978-0-387-95868-2 _2doi
082	0	4	_a541.37 _223
100	1		_aShacham-Diamand, Yosi. _eeditor.
245	1	0	_aAdvanced Nanoscale ULSI Interconnects: Fundamentals and Applications _h[electronic resource] / _cedited by Yosi Shacham-Diamand, Tetsuya Osaka, Madhav Datta, Takayuki Ohba.
264		1	_aNew York, NY : _bSpringer New York, _c2009.
300			_bonline resource.
336			_atext _btxt _2rdacontent
337			_acomputer _bc _2rdamedia
338			_aonline resource _bcr _2rdacarrier
347			_atext file _bPDF _2rda
505	0		_aChallenges in ULSI Interconnects - Introduction to the Book -- Technology Background -- MOS Device and Interconnects Scaling Physics -- Interconnects in ULSI Systems: Cu Interconnects Electrical Performance -- Electrodeposition -- Electrophoretic Deposition -- Wafer-Level 3D Integration for ULSI Interconnects -- Interconnect Materials -- Diffusion Barriers for Ultra-Large-Scale Integrated Copper Metallization -- Silicides -- Materials for ULSI metallization - Overview of Electrical Properties -- Low-? Materials and Development Trends -- Electrical and Mechanical Characteristics of Air-Bridge Cu Interconnects -- ALD Seed Layers for Plating and Electroless Plating -- Deposition Processes for ULSI Interconnects -- Electrochemical Processes for ULSI Interconnects -- Atomic Layer Deposition (ALD) Processes for ULSI Manufacturing -- Electroless Deposition Approaching the Molecular Scale -- Modeling -- Modeling Superconformal Electrodeposition Using an Open Source PDE Solver -- Electrochemical Process Integration -- to Electrochemical Process Integration for Cu Interconnects -- Damascene Concept and Process Steps -- Advanced BEOL Technology Overview -- Lithography for Cu Damascene Fabrication -- Physical Vapor Deposition Barriers for Cu metallization - PVD Barriers -- Low-k Dielectrics -- CMP for Cu Processing -- Electrochemical View of Copper Chemical-Mechanical Polishing (CMP) -- Copper Post-CMP Cleaning -- Electrochemical Processes and Tools -- Electrochemical Processing Tools for Advanced Copper Interconnects: An Introduction -- Electrochemical Deposition Processes and Tools -- Electroless Deposition Processes and Tools -- Tools for Monitoring and Control of Bath Components -- Processes and Tools for Co Alloy Capping -- Advanced Planarization Techniques -- Metrology -- Integrated Metrology (IM) History at a Glance -- Thin Film Metrology - X-ray Methods -- Summary and Foresight -- Emerging Nanoscale Interconnect Processing Technologies: Fundamental and Practice -- Self-Assembly of Short Aromatic Peptides: From Amyloid Fibril Formation to Nanotechnology.
520			_aAdvanced Nanoscale ULSI Interconnects: Fundamental and Applications brings a comprehensive description of copper based interconnect technology for Ultra Large Scale Integration (ULSI) technology to Integrated Circuit (ICs) application. This book reviews the basic technologies used today for the copper metallization of ULSI applications: deposition and planarization. It describes the materials used, their properties, and the way they are all integrated, specifically in regard to the copper integration processes and electrochemical processes in the nanoscale regime. The book also presents various novel nanoscale technologies that will link modern nanoscale electronics to future nanoscale based systems. This diverse, multidisciplinary volume will appeal to process engineers in the microelectronics industry; universities with programs in ULSI design, microelectronics, MEMS and nanoelectronics; and professionals in the electrochemical industry working with materials, plating and tool vendors.
650		0	_aCHEMISTRY.
650		0	_aCHEMICAL ENGINEERING.
650		0	_aCOMPUTER ENGINEERING.
650		0	_aMATERIALS.
650		0	_aNANOTECHNOLOGY.
650	1	4	_aCHEMISTRY.
650	2	4	_aELECTROCHEMISTRY.
650	2	4	_aMATERIALS SCIENCE, GENERAL.
650	2	4	_aINDUSTRIAL CHEMISTRY/CHEMICAL ENGINEERING.
650	2	4	_aELECTRICAL ENGINEERING.
650	2	4	_aNANOTECHNOLOGY.
700	1		_aOsaka, Tetsuya. _eeditor.
700	1		_aDatta, Madhav. _eeditor.
700	1		_aOhba, Takayuki. _eeditor.
710	2		_aSpringerLink (Online service)
773	0		_tSpringer eBooks
776	0	8	_iPrinted edition: _z9780387958675
856	4	0	_uhttp://dx.doi.org/10.1007/978-0-387-95868-2 _zVer el texto completo en las instalaciones del CICY
912			_aZDB-2-CMS
942			_2ddc _cER
999			_c59557 _d59557