000			03741nam a22004815i 4500
001			978-0-85729-236-0
003			DE-He213
005			20251006084443.0
007			cr nn 008mamaa
008			110512s2011 xxk| s |||| 0|eng d
020			_a9780857292360
020			_a99780857292360
024	7		_a10.1007/978-0-85729-236-0 _2doi
082	0	4	_a621.381 _223
100	1		_aGrossmann, Günter. _eeditor.
245	1	4	_aThe ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects _h[electronic resource] / _cedited by Günter Grossmann, Christian Zardini.
264		1	_aLondon : _bSpringer London, _c2011.
300			_aVIII, 313 p. 202 illus., 22 illus. in color. _bonline resource.
336			_atext _btxt _2rdacontent
337			_acomputer _bc _2rdamedia
338			_aonline resource _bcr _2rdacarrier
347			_atext file _bPDF _2rda
505	0		_a1. Deformation and Fatigue of Solders -- 2. Factors Affecting the Bulk Embrittlement of Pb-Free Solder Joints -- 3. Thermal Fatigue Analysis -- 4. Electrochemical Behavior of Solder Alloys -- 5. Void Formation by Kirkendall Effect in Solder Joints -- 6. Tin Whiskers -- 7. Electromigration in Solder Interconnects -- 8. Impact of Black Pad and Intermetallic Layers on the Risk for Fractures in Solder Joints to Electroless Nickel/Immersion Gold -- 9. Reliability of Electronic Assemblies under Mechanical Shock Loading -- 10. Impact of Humidity and Contamination on Surface Insulation Resistance and Electrochemical Migration -- 11. Lead Free and Other Process Effects on Conductive Anodic Filamentation (CAF) Resistance of Glass Reinforced Epoxy Laminates -- 12. PCB Delamination -- 13. Excessive Warpage of Large Packages during Reflow Soldering -- 14. Popcorn Cracking -- 15. Thermal Capability of Components.
520			_aThe ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contributions from the leading European experts in lead-free soldering. The limited validity of testing methods originating from tin-lead solder was a major point of concern in ELFNET members' discussions. As a result, the network's reliability group decided to bring together the material properties of lead-free solders, as well as the basics of material science, and to discuss their influence on the procedures for accelerated testing. This has led to a matrix of failure mechanisms and their activation and, as a result, to a comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints. The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is written for scientists, engineers and researchers involved with lead-free electronics.
650		0	_aENGINEERING.
650		0	_aSYSTEM SAFETY.
650		0	_aELECTRONICS.
650		0	_aOPTICAL MATERIALS.
650		0	_aSURFACES (PHYSICS).
650	1	4	_aENGINEERING.
650	2	4	_aELECTRONICS AND MICROELECTRONICS, INSTRUMENTATION.
650	2	4	_aOPTICAL AND ELECTRONIC MATERIALS.
650	2	4	_aQUALITY CONTROL, RELIABILITY, SAFETY AND RISK.
650	2	4	_aCHARACTERIZATION AND EVALUATION OF MATERIALS.
700	1		_aZardini, Christian. _eeditor.
710	2		_aSpringerLink (Online service)
773	0		_tSpringer eBooks
776	0	8	_iPrinted edition: _z9780857292353
856	4	0	_uhttp://dx.doi.org/10.1007/978-0-85729-236-0 _zVer el texto completo en las instalaciones del CICY
912			_aZDB-2-ENG
942			_2ddc _cER
999			_c59989 _d59989