000			02937nam a22005055i 4500
001			978-1-4020-4589-9
003			DE-He213
005			20251006084512.0
007			cr nn 008mamaa
008			100301s2006 ne | s |||| 0|eng d
020			_a9781402045899
020			_a99781402045899
024	7		_a10.1007/1-4020-4589-1 _2doi
082	0	4	_a620.1 _223
100	1		_aDziuban, Jan A. _eauthor.
245	1	0	_aBonding in Microsystem Technology _h[electronic resource] / _cby Jan A. Dziuban.
264		1	_aDordrecht : _bSpringer Netherlands, _c2006.
300			_aXVIII, 331 p. 296 illus. _bonline resource.
336			_atext _btxt _2rdacontent
337			_acomputer _bc _2rdamedia
338			_aonline resource _bcr _2rdacarrier
347			_atext file _bPDF _2rda
490	1		_aSpringer Series in Advanced Microelectronics, _x1437-0387 ; _v24
505	0		_aSome Remarks on Microsystem Systematics and Development -- Deep, Three-Dimensional Silicon Micromachining -- Bonding -- Classification of Bonding and Closing Remarks.
520			_aBonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author's personal experience.
650		0	_aENGINEERING.
650		0	_aMATERIALS.
650		0	_aSTRUCTURAL CONTROL (ENGINEERING).
650		0	_aELECTRONICS.
650		0	_aOPTICAL MATERIALS.
650	1	4	_aENGINEERING.
650	2	4	_aCONTINUUM MECHANICS AND MECHANICS OF MATERIALS.
650	2	4	_aPHYSICS AND APPLIED PHYSICS IN ENGINEERING.
650	2	4	_aOPTICAL AND ELECTRONIC MATERIALS.
650	2	4	_aELECTRONICS AND MICROELECTRONICS, INSTRUMENTATION.
650	2	4	_aOPERATING PROCEDURES, MATERIALS TREATMENT.
710	2		_aSpringerLink (Online service)
773	0		_tSpringer eBooks
776	0	8	_iPrinted edition: _z9781402045783
830		0	_aSpringer Series in Advanced Microelectronics, _x1437-0387 ; _v24
856	4	0	_uhttp://dx.doi.org/10.1007/1-4020-4589-1 _zVer el texto completo en las instalaciones del CICY
912			_aZDB-2-ENG
942			_2ddc _cER
999			_c60931 _d60931